Technical Description
The present invention relates to a compact, cost-efficient ultrasonic vibration-assisted grinding system that uses minimal lubrication, eliminates thermal shock, and enhances surface integrity.
Problems Addressed
- Complex Arrangement
- Operational Challenges
- High Maintenance Cost
- Environmentally Harmful
- Lack of Lubrication
- Affects Surface Quality
- Impacts Material Removal Rate
- Expensive Work Piece Holder
Tech Features
- Cost-Efficient & Eco-friendly
- Minimal Lubrication Utilization
- Improved Surface Integrity
- Thermal Shock Elimination
- Compact & Reduced Vibration Losses
- Dry &Wet Grinding Operation
Target Audience
- Automotive Industry
- Aerospace Industry
- Semiconductor Industry
- Research & Development
Tech ID: P18-1171 TRL 5 Patent Status: Granted Available For Exclusive and Non-exclusive License
