Technical Description
This invention relates to a modular micro blending apparatus designed for high-precision bending of sheet metals. It enables controlled micro forming at room and high temperatures, while supporting interchangeable punch die sets and seamless integration with SEM/EBSD and DIC systems for advanced microstructural characterization.
Problems Addressed
- Lacks Bendability
- Unpredictable Plasticity
- Inefficient Spring Back Control
- Lacks Micro Foaming
- Complex In Situ Characterization
- Costly SEM Setups
Tech Features
- Efficient Modular Design
- Better Punch-Die Interchange
- Enhanced Material Compatibility
- Better Spring Back Control
- Enhanced Temperature Capability
- Improved Micro Characterization Integration
Target Audience
- Aerospace Component Manufactures
- Microelectronic & Mems Industries
- Biomedical Micro Device Manufactures
- Automotive Lightweight Materials Sector
- Research & Development
Tech ID: P13-1762 TRL 6 Patent Status: Granted Available For Exclusive and Non-exclusive License
