Substrate’s Roughness Reduction

Technical Description

The present invention relates to top surface roughness reduction of substrates by deposition process.

Problems Addressed

  • Cumbersome Process
  • Limitations of Existing Techniques
  • Expensive
  • Suboptimal Performance
  • Lack of Scalability

Tech Features

  • Simplezr Method
  • Effective System
  • Ease of Performance
  • Reduced Roughness
  • Economical & Durable
  • Scalable
  • Reliable Method

Target Audience

  • Manufacturing & Tooling Industry
  • Electronics & Semiconductor Industry
  • Aerospace & Defence Sector
  • Research & Development
Tech ID: P16-1824 TRL 4 Patent Status: Granted Available For Exclusive and Non-exclusive License
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P16-1824

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Contact For Licensing

Lalit Ambastha

+91- 9811367838

Dr. Medha Kaushik

+91- 6359777555

tech@ipbazzaar.com

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