Technical Description
This invention presents an integrated cooling system that utilizes a two-phase heat transfer cycle within a specialized cavity, combining enhanced boiling plates and super hydrophobic condensing structures to dissipate high heat fluxes from compact electronic components.
Problems Addressed
- Limited Thermal Efficiency
- Poor Flux Management
- Complex System Designs
- High Manufacturing Costs
- Inadequate Integrated Cooling
- Component Failure Risk
Tech Features
- Integrated Vapor Cavity
- Mini-Channel Boiling Plate
- Super hydrophobic Inner Surfaces
- Hollow Longitudinal Fins
- Dropwise Condensation Promotion
- Two-Phase Fluid Cycle
Target Audience
- Consumer Electronics Sector
- Aerospace Thermal Management
- High-Power Semiconductor Industry
- Telecommunications Hardware Firms
- Automotive Computing Systems
- Research & Development
Tech ID: P16-1945 TRL 5 Patent Status: Granted Available For Exclusive and Non-exclusive License
