Ambient Electrospray Copper Sulphide Nanostructures

Technical Description

The invention relates to a method of generating diverse phases of copper sulphide nanostructures using ambient electrospray deposition (ESD) of molecular sulphur droplets onto metallic copper surfaces. By adjusting deposition time under atmospheric conditions, the process controllably transitions the material from semiconducting Cu2S nanopyramids to metallic Cu1.8S platelets without needing high temperatures.

Problems Addressed

  • Mixed-Phase Dislocations
  • Solution-Phase Morphological Instability
  • High-Temperature Constraints
  • Diffusion-Induced Defects
  • Complex Multi-Stage Synthesis
  • Severe Precursor Degradation

Tech Features

  • Ambient Phase Engineering
  • Controlled Electrohydrodynamic Deposition
  • Enhanced Plasmon Resonance
  • Scalable Solid-State Morphology
  • Tunable Plasmonic Response
  • Efficient Stoichiometric Transformation

Target Audience

  • Optoelectronic Device Sectors
  • Thermoelectric Material Industries
  • Biomedical Therapy Sectors
  • Advanced Semiconductor Manufacturing
  • Solar Energy Industries
  • Research & Development
Tech ID: P23-2019 TRL 6 Patent Status: Granted Available For Exclusive and Non-exclusive License
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P23-2019

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Contact For Licensing

Lalit Ambastha

+91- 9811367838

Dr. Medha Kaushik

+91- 6359777555

tech@ipbazzaar.com

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