Technical Description
The invention introduces a nanoscale metal interconnects using zinc oxide nanoribbons, where the edges of nanoribbons are passivated to act as metal connections. This process allows for the manufacturing of electronic devices, and focuses on evaluating how well the nanoribbons perform at nanoscale dimensions.
Problems Addressed
- High Resistivity
- Power Dissipation Issue
- Limited Scalability of Devices
- Electromigration in Copper
- Grain-Boundary Scattering Effects
Tech Features
- Tailored Edge Passivation
- High Fermi Velocity
- Improved Thermal Management
- Central Scattering Region
- Nanoscale Interconnects
- Quantum Capacitance Optimization
Target Audience
- Semiconductor Manufacturing Industry
- Electronics Industry
- Nanotechnology Sector
- Microelectronics Industry
- Material Science Research
Tech ID: P26-1212 TRL 4 Patent Status: Granted Available For Exclusive and Non-exclusive License
