Tech ID: P06 - 1408 TRL : 4 Patent Status : Published Available For : Exclusive and Non-exclusive License
Technical Description
The technology presents a high-conductivity 3D printing metallic ink with 93-97% copper loading, optimized for direct ink writing and liquid metal battery fabrication, using high-temperature, low-pressure spark plasma sintering for enhanced performance.
Problems Addressed
- High-Cost Fabrication
- Poor Ink Flow & Clogging
- Limited Mechanical Strength
- Complicated Process
- Limitations of Existing 3D Printing Inks
Target Audience
- Electronics Sector
- Aerospace & Defense Sector
- Automotive Industry
- Biomedical & Healthcare Sector
- Research & Development
Tech Features
- Smooth Ink Flow
- Shear Thinning Behavior
- Linear Viscoelasticity
- Optimized Storage Modulus
- Cost Effective & Reliable
- Robust Mechanical Properties
- Direct Ink Writing Compatibility
- Streamlined Process
LALIT AMBASTHA
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