Technical Description
This invention relates to heat sink for electronic cooling, particularly phase charge material (PCM)-based heat sinks with improved heat dissipation efficiency.
Problems Addressed
- Lacks Air Cooling Efficiency
- Inefficient Dissipation
- Lacks Thermal Conductivity
- Inefficient Charging/Discharging Cycle
- Lacks Durability
- Inefficient Integration
Tech Features
- Efficient Heat Absorption
- Enhanced Heat to Sink Transfer
- Better Heat Cycle Time Operation
- Efficient Device Load Cooling
- Stable PCM Integration
- Better Dissipation Under Rotation
Target Audience
- Electronics Cooling System Manufacturers
- Semiconductor and Microprocessor Industries
- Aerospace And Avionics Equipment Manufacturers
- Research and Development
Tech ID: P16-1577 TRL 5 Patent Status: Granted Available For Exclusive and Non-exclusive License
