Technical Description
It describes a variable film deposition process under high pressure and moderate temperature, applicable for various substrates and cost-effective applications.
Problems Addressed
- Limited Thickness
- Inefficient Process
- Complex Process
- High Production Cost
Tech Features
- Thickness Control
- Variable Crystallinity
- Enhanced Stability
- Single-Step Process
- Tunable Roughness
- Cost Efficient
Target Audience
- Medical and Healthcare
- Power Sector
- Electronic Industry
- Research & Development
Tech ID: P26-1605 TRL 4 Patent Status: Granted Available For Exclusive and Non-exclusive License
