Technical Description
The invention provides a durable metal-faced identification and payment card that enables both close-range and wireless interaction. Its layered construction guides signals around the metal surface, while a specialized filling method secures the internal electronics without underlying adhesive, simplifying production, reducing material issues, and improving manufacturing output.
Problems Addressed
- Layer Shrinkage
- Lamination Defects
- Thermal Soldering Dependency
- Complex Assembly Process
- Material Compatibility Issues
Tech Features
- Thermoplastic adhesive layer
- Stainless Steel Layer
- Dual Interface Operation
- Payment Data Storage
- Pressure Controlled Lamination
- Heat-Activated Bonding
Target Audience
- Smart Card Industry
- Digital Payments Industry
- Fintech Industry
- Security Technology Industry
- Identity Management Industry
Tech ID: P18-2170 TRL 9 Patent Status: Granted in IN, US, ZA and AU &
Published in CO, DE, JP, ID, MX, BR, TH, AEP and CA Available For Exclusive and Non-exclusive License
Published in CO, DE, JP, ID, MX, BR, TH, AEP and CA Available For Exclusive and Non-exclusive License
