Technical Description
The invention is an electromagnetic interference (EMI) shielding film made of a conducting polymer and a semiconductor filler. The filler content is 5-20%, with a dielectric permittivity of 4-20. This film can coat surfaces and be used in boxes, containers, gaskets, fibers, cables, and meshes for electronic protection.
Problems Addressed
- Complex Synthesis
- High Impedance Mismatch
- Poor Absorption Tendency
- High Secondary Pollution
- Excessive Wave Reflection
Tech Features
- EMI Shielding Film
- Low Reflection Shielding
- Reduced Secondary Pollution
- Reduced Impedance Mismatch
- Enhanced Absorption Rate
Target Audience
- Electronics Industries
- Aerospace & Aviation Sector
- Defence & Military Sector
- Research & Development
- Telecommunications Industry
Tech ID: P23-1491 TRL 4 Patent Status: Granted Available For Exclusive and Non-exclusive License
